CLCTN4
LanguageENG
PublishYear2021
publishCompany
WSPC
EISBN
9789811218361
PISBN
9789811218354
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3D printed electronics have captured much attention in recent years, owing to their success in allowing on-demand fabrication of highly-customisable electronics on a wide variety of substrates and conformal surfaces. This textbook helps readers understand and gain valuable insights into 3D printed electronics. It does not require readers to have any prior knowledge on the subject.3D Printing and Additive Manufacturing of Electronics: Principles and Applications provides a comprehensive overview of the recent progress and discusses the fundamentals of the 3D printed electronics technologies, their respective advantages, shortcomings and potential applications. The book covers conventional contact printing techniques for printed electronics, 3D electronics printing techniques, materials and inks inks for 3D-printed electronics, substrates and processing for 3D-printed electronics, sintering techniques for metallic nanoparticle inks, designs and simulations, applications of 3D-printed electronics, and future trends. The book includes several related problems for the reader to test his or her understanding of the topics.This book is a good guide for anyone who is interested in the 3D printing of electronics. The book is also an effective textbook for undergraduate and graduate courses that aim to arm their students with a thorough understanding of the fundamentals of 3D printed electronics.Related Link(s)
Chee Kai CHUA is the Head of Pillar for Engineering Product Development and Cheng Tsang Man Chair Professor at Singapore University of Technology and Design (SUTD). Dr Chua has extensive teaching and consulting experience in 3D Printing and Additive Manufacturing (3DP & AM). He is an active contributor to the Additive Manufacturing (AM or 3D Printing) field for over 30 years, where his re-design of AM processes for innovative devices such as tissue engineering scaffolds are highly regarded by the scientific community. He is now active in 3D printing of electronics, food, metals and polymers. He won the prestigious International Freeform and Additive Manufacturing Excellence (FAME) Award in 2018. As at 2020, he has contributed more than 400 technical papers and patents, generating more than 14,000 citations, and co-authored four books including 3D Printing and Additive Manufacturing: Principles and Applications (5th edition) and Bioprinting: Principles and Applications. In addition, he is the chief editor of Virtual and Physical Prototyping as well as International Journal of Bioprinting.Wai Yee YEONG is an Associate Professor at School of Mechanical and Aerospace Engineering (MAE), Nanyang Technological University, Singapore. She also serves as Associate Chair (Students) at MAE She has published more than 150 papers, generating more than 4900 citations with a current H-index of 35, and co-authored 2 textbooks (published by World Scientific and Elsevier respectively). Her works have been featured on media such as CNA, the Straits Times and other media channels. Her portfolio also includes serving as Programme Director (Aerospace and Defence) at Singapore Centre for 3D Printing (SC3DP) and at HP-NTU Digital Manufacturing Corporate Labs. She has filed 6 patents applications and 14 know-hows. Her main research interest is in 3D printing, bioprinting and the translational of the advanced technologies for industrial applications. Her current research topics include 3D printing of new materials, hybrid electronic-mechanical structures and bioprinting for tissue engineering. She was named the winner of TCT Women in 3D Printing Innovator Award 2019.Hong Yee LOW received her PhD from the Macromolecular Science and Engineering department of Case Western Reserve University in 1998. After 2 years at Motorola Semiconductor Sector, she worked at the Institute of Materials Research and Engineering (IMRE), Agency for Science Technology and Research, Singapore for 13 years. In IMRE she spearheaded nanoimprinting research, held the position as group head of Patterning and Fabrication Capability Group and Director of Research and Innovation. She is currently an associate professor in the Engineering Product Development Pillar (EPD) at the Singapore University of Technology and Design (SUTD) and the director for the Digital Manufacturing and Design (DmanD) centre. Her primary research interest is in nanofabrication of functional surfaces. She has co-authored >150 peer reviewed publications and is a co-inventor of 30 granted patents.Tuan TRAN is currently an Associate Professor of the School of Mechanical and Aerospace Engineering, Nanyang Technological University (NTU), Singapore. He also acts as the Deputy Director of the NTU hub at Singapore's National Additive Manufacturing Innovation Cluster (NAMIC) with the mission to provide financial support for translational research in 3D printing and promote adoption of 3D printing in Singapore's industrial ecosystem. His research in 3D printing encompasses a wide range of activities, from fundamental works in development of droplet- and powder-based 3D printing technologies to translational works such as standards and qualification in 3D printing and 3D printing of conventional and wearable electronics. He has authored 40 journal papers in multiphase flows, droplet-surface interactions, and 3D printing. He holds patents for embedding identifiers in 3D printed parts and in-situ monitoring of 3D printing processes. His work on in-situ monitoring of 3D printing processes has been selected by ASTM to develop into industry standards.Hong Wei TAN is currently a research fellow in the Engineering Product Development Pillar (EPD) at the Singapore University of Technology and Design (SUTD). He received his BEng (First-Class Honours) and PhD degrees in Mechanical Engineering from Nanyang Technological University, Singapore. He has filed one PCT patent in sintering metallic nanoparticle inks for 3D printed electronics applications. His research interests are additive manufacturing processes for 3D printed electronics and materials characterisations.
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